Wafer Level 3-D ICS Process Technology by Chuan Seng Tan
English | 19 Sept. 2008 | ISBN: 0387765328 | 365 Pages | PDF | 14 MB
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging.